- modem. A
licensed version of the
Exatron Stringy Floppy as a
digital "
Wafertape" unit
depicted on the computer's box was only
released as a prototype...
-
wafers are
commonly laminated with UV-curable back-grinding
tape,
which ensures against wafer surface damage during back-grinding and
prevents wafer surface...
-
Dicing tape is a
backing tape used
during wafer dicing or some
other microelectronic substrate separation, the
cutting apart of
pieces of semiconductor...
- dicing,
wafers are
typically mounted on
dicing tape which has a
sticky backing that
holds the
wafer on a thin
sheet metal frame.
Dicing tape has different...
- were
planned or produced. A
WaferTape drive never made it past the
prototype stage due to
reliability issues with the
tapes. The 5.25-inch
floppy drive...
-
During this step, the
wafer is
mounted on a
plastic tape that is
attached to a ring.
Wafer mounting is
performed right before the
wafer is cut into separate...
-
production to TSMC. At
least one
semiconductor company, LSI, re-sells TSMC
wafers through its ASIC
design services and
design IP portfolio.[dubious – discuss]...
-
figure on the left). Initially, the team used a
silicon wafer as a substrate, but
found that the
tape's adhesive power increased by
almost 1,000
times if they...
- circuits)
Wafer mounting (
wafer is
mounted onto a
metal frame using dicing tape)
Wafer backgrinding and
polishing (reduces the
thickness of the
wafer for thin...
- the
wafer during the
final wafer processing step. In
order to
mount the chip to
external circuitry (e.g., a
circuit board or
another chip or
wafer), it...
