- IBM 3081 mainframe's
thermal conduction module (1980s)
Superconducting Multichip modules (1990s)
Intel Pentium Pro,
Pentium II OverDrive,
Pentium D Presler...
-
those devices. For this standard, the term "devices"
includes monolithic,
multichip, film and
hybrid microcircuits,
microcircuit arrays, and the elements...
- and the
printed circuit board, as well as
between stacked packages in
multichip modules; in the
latter case, they may be
referred to as
microbumps (μbumps...
- July 2012. Lau, John H. (30 June 1994). Chip on Board:
Technology for
Multichip Modules. Springer. ISBN 978-0-442-01441-4. "What is the Die
Attach process...
-
Universal Flash Storage (UFS) is a
flash storage specification for
digital cameras,
mobile phones and
consumer electronic devices. It was
designed to bring...
-
Micron United
States IDM DRAM, NAND flash, SSD, NOR flash,
Managed NAND,
multichip packages Qualcomm United
States Fabless RF module,
digital signal processor...
-
requirements of
fully ****embled devices,
whether they are
single chip,
multichip, or of
hybrid technology. The test
procedures of
these requirements are...
-
module (MCM) Lau, John H. (1994-06-30). Chip On Board:
Technology for
Multichip Modules.
Springer Science &
Business Media. ISBN 978-0-442-01441-4. Einspruch...
-
Semiconductor MAS281. A
radiation hardened SOC
implementation on a 64-pin
multichip module with an
optional MMU. GEC-Plessey RH1750, a radiation-hardened...
- com.
Retrieved 2022-05-08. John H. Lau, Chip On Board:
Technology for
Multichip Modules,
Springer Science &
Business Media, 1994 ISBN 0442014414 pages...
