- IBM 3081 mainframe's
thermal conduction module (1980s)
Superconducting Multichip modules (1990s)
Intel Pentium Pro,
Pentium II OverDrive,
Pentium D Presler...
-
those devices. For this standard, the term "devices"
includes monolithic,
multichip, film and
hybrid microcircuits,
microcircuit arrays, and the elements...
-
Universal Flash Storage (UFS) is a
flash storage specification for
digital cameras,
mobile phones and
consumer electronic devices. It was
designed to bring...
- and the
printed circuit board, as well as
between stacked packages in
multichip modules; in the
latter case, they may be
referred to as
microbumps (μbumps...
-
Micron United
States IDM DRAM, NAND flash, SSD, NOR flash,
Managed NAND,
multichip packages Qualcomm United
States Fabless RF module,
digital signal processor...
- July 2012. Lau, John H. (30 June 1994). Chip on Board:
Technology for
Multichip Modules. Springer. ISBN 978-0-442-01441-4. "What is the Die
Attach process...
- com.
Retrieved 2022-05-08. John H. Lau, Chip On Board:
Technology for
Multichip Modules,
Springer Science &
Business Media, 1994 ISBN 0442014414 pages...
-
module (MCM) Lau, John H. (1994-06-30). Chip On Board:
Technology for
Multichip Modules.
Springer Science &
Business Media. ISBN 978-0-442-01441-4. Einspruch...
-
Electronics Engineers (IEEE) in 2013 for his
development of three-dimensional
multichip modules and flip chip interconnects. "2013
elevated fellow" (PDF). IEEE...
- Boahen,
Kwabena (April 24, 2014). "Neurogrid: A Mixed-Analog-Digital
Multichip System for Large-Scale
Neural Simulations".
Proceedings of the IEEE. 102...
