- multi-gate
devices are the
FinFET (fin field-effect transistor) and the
GAAFET (gate-all-around field-effect transistor),
which are non-planar transistors...
- technology,
despite TSMC
developing GAAFET transistors. Specifically,
Samsung plans to use its own
variant of
GAAFET called MBCFET (multi-bridge channel...
-
channel FET, Samsung's
version of
GAAFET) 2 nm
process in 2025.[needs update] In
April 2022, TSMC
announced its
GAAFET N2
process technology would enter...
-
nanosheets in a gate-all-around
configuration (
GAAFET), a
break from the
usual FinFET design. The
GAAFET transistors used had 3
nanosheets stacked on top...
- in the 1980s. He also
invented the
first gate-all-around (GAA)
MOSFET (
GAAFET) transistor, an
early non-planar 3D transistor, in 1988.
Masuoka attended...
- comparison, the gate-all-around
MOSFET (
GAAFET)
structure has even
better gate control. A gate-all-around
MOSFET (
GAAFET) was
first demonstrated in 1988, by...
-
transistor (FinFET), source/drain
region shapes fins on the
silicon surface GAAFET,
Similar to
FinFET but
nanowires are used
instead of fins, the nanowires...
- M****
Production of 3nm
GAAFET Chips in 2021", Tom's
Hardware Smith, Ryan. "Samsung
Starts 3nm Production: The Gate-All-Around (
GAAFET) Era Begins". www.anandtech...
- In 2019,
Samsung announced plans for the
commercial production of a 3 nm
GAAFET process by 2021. FD-SOI (Fully
Depleted Silicon On Insulator) has been seen...
- follows:
Logic chips with non-planar
transistor architectures (I.e.,
FinFET or
GAAFET) of 16 nm or 14 nm, or below; DRAM
memory chips of 18 nm half-pitch or less;...
