-
University Of Vienna.
Coucoulas co-aut****d a
paper with Dr.
Komarek which included his thesis,. His spouse,
Marie Janssen Coucoulas, pla**** a significant...
-
Coucoulas was
named "Father of
Thermosonic Bonding" by
George Harman, the world's
foremost authority on wire bonding,
where he
referenced Coucoulas's...
-
Bonding |
Semiconductor Digest". "AEC Q006" (PDF). www.aecouncil.com. A.
Coucoulas, "Compliant Bonding"
Proceedings 1970 IEEE 20th
Electronic Components...
-
around the edge of the die.
Thermosonic bonding was
first introduced by A.
Coucoulas which provided a
reliable means of
forming these vital electrical connections...
- Packaging. MEMS
Industry Group (Report). Vol. 4. SUSS
MicroTec Inc. A.
Coucoulas, “Compliant Bonding”
Proceedings 1970 IEEE 20th
Electronic Components...
- bond.
Alexander Coucoulas "Bonding With A
Compliant Medium". U.S.
patent 3,533,155.
October 13, 1970.
Filed July 6, 1967.
Coucoulas, A. (1970) “Compliant...
- Holocaust, Jewish-Catholic relations, and
American literature Alexander Coucoulas – inventor,
research engineer, and
author Raphael Demos –
Alford Professor...
-
Corneliszoon (1550–1607), The
Netherlands – wind
powered sawmill Alexander Coucoulas (born 1933), U.S. –
Thermosonic bonding Wallace H.
Coulter (1913–1998)...
