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Bumpless Build-up
Layer (BBUL) is a
processor packaging technology developed by Intel. It is
bumpless,
because it does not use the
usual tiny
solder bumps...
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responsive control system. PID
controllers are
often implemented with a "
bumpless"
initialization feature that
recalculates the
integral ac****ulator term...
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snake gourds (Trichosanthes spp.). The skin is very thin,
light green, and
bumpless. It has no
bitterness and the
fruit is
almost always used
without peeling...
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power limits,
undervolting or
underclocking the CPU. 5 nm
process ASCI Red
Bumpless Build-up
Layer Comparison of ATI
graphics processing units Comparison of...
- Herbst,
Gernot (2015). "Practical
active disturbance rejection control:
Bumpless transfer, rate limitation, and
incremental algorithm". IEEE Transactions...
- loop is
active without causing a step in the
output q20; that is, it's a
bumpless control. The
overall maximum/minimum
limit is
designed to
prevent the equivalent...
- 27 June 2006 Page(s): 386–390 Kirrmann,
Hubert Seamless redundancy -
bumpless Ethernet redundancy for
substations with IEC 61850 ABB
review special report...
- June 27, 2006 Page(s):386 – 390 Kirrmann,
Hubert Seamless redundancy -
bumpless Ethernet redundancy for
substations with IEC 61850 ABB
review special report...
- are
covered with
projecting hairs (not just at the edges), or no hairs,
bumpless. The
leaves are
weakly toothed or toothless, to 7(11) x 4.5(6) mm, leaf...
- Itoh, T.; Matsuo, M.; Hayasaka, N.; Okumura, K.; Suga, T. (2006-05-01). "
Bumpless interconnect through ultrafine Cu
electrodes by
means of surface-activated...
