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Wafer backgrinding is a
semiconductor device fabrication step
during which wafer thickness is
reduced to
allow stacking and high-density
packaging of integrated...
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processing (BEOL),
where wafers are
normally very much
thinner after wafer backgrinding, and very
sensitive to
thermal or
mechanical stress.
Etching a thin layer...
-
stacked sensor, the X-Trans 5 HS, used in the
Fujifilm X-H2S.
Wafer backgrinding Sony, 2009 US
patent 7521335, Yamanaka, Hideo, "Method and apparatus...
- cleanroom,
often by a
different company. It
includes wafer test,
wafer backgrinding, die separation, die tests, IC
packaging and
final test.
Front end of...
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mounting (wafer is
mounted onto a
metal frame using dicing tape)
Wafer backgrinding and
polishing (reduces the
thickness of the
wafer for thin
devices like...
-
Technologies provides post
processing services for
wafer testing,
wafer backgrinding,
wafer preparation,
wafer dicing,
integrated circuit (IC) packaging,...
- 21 May 2013.
Retrieved 14
April 2013. "Wafer
Dicing Service |
Wafer Backgrinding &
Bonding Services". www.syagrussystems.com.
Retrieved 2021-11-20. M...
- technology. For some applications, the
separation is
preceded by
wafer backgrinding in
order to
reduce the
wafer thickness.
Wafer dicing may then be performed...
